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Fiber Optic
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Liquid Flux |
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| Lead - Free | |
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With global to move toward lead-free environment, SHENMAO Micro Material Institute(SMMI) already started to research and develop Lead-Free Data since 2001 , even more, development cooperated with Industrial Technology Research Institute (Taiwan), Electronics Assembly and IC-packaging manufacturers, as well as ability to assist our customer to bring their Pb-Free products to market quickly. SHENMAO Lead-Free solder alloy have received sub-license from IOWA State University Research Foundation and Fuji Electric Holdings Co., Ltd. O PF606, U.S Patent No. 5.527.628 (IOWA State University Research Foundation) O PF610, Japan Patent No. 3296289. U.S Patent NO. 6179935B1 (Fuji Electric Holdings Co., Ltd.). SHENMAO 's lead free solder alloy available for paste, core solder wire, bar, ball/ semi ball, Bga Sphere, anode, etc.
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| Lead Free Solder Pastes | |
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| Lead Free Solder Pastes | |
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| Item | Alloy Composition | Melting Point (¢XC) | Particle Size (£gm) | Flux Type | Flux Content (%) | Viscosity (Pa.s) |
|---|---|---|---|---|---|---|
| PF603-P | Sn/Ag3.5 | 221 | 20-38 20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF606-P | Sn/Ag3.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF607-P | Sn/Ag3.5/Cu0.7 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF608-P | Sn/Ag3.9/Cu0.6 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF609-P | Sn/Ag3.8/Cu0.7 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF610-P | Sn/Ag3.0/Cu0.7/Ni0.06/Ge0.01 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF614-P | Sn/Ag4.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| Item | Alloy Composition | Melting Point (¢XC) | Particle Size (£gm) | Flux Type | Flux Content (%) | Viscosity (Pa.s) |
|---|---|---|---|---|---|---|
| PF603-P25 | Sn/Ag3.5 | 221 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF606-P25 | Sn/Ag3.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF607-P25 | Sn/Ag3.5/Cu0.7 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF608-P25 | Sn/Ag3.9/Cu0.6 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF609-P25 | Sn/Ag3.8/Cu0.7 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF610-P25 | Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| PF614-P25 | Sn/Ag4.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL0 | 11¡Ó0.5 | 200¡Ó30 |
| Item | Alloy Composition | Melting Point (¢XC) | Particle Size (£gm) | Flux Type | Flux Content (%) | Viscosity (Pa.s) |
|---|---|---|---|---|---|---|
| PF602-P27 | Sn/Bi58 | 138 | 20-38/ 20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF612-P27 | Sn/Zn8.0/Bi3.0 | 190-199 | 20-38/20-45 | ROL1 | 12¡Ó0.5 | 200¡Ó30 |
| Item | Alloy Composition | Melting Point (¢XC) | Particle Size (£gm) | Flux Type | Flux Content (%) | Viscosity (Pa.s) |
|---|---|---|---|---|---|---|
| PF603-P58 | Sn/Ag3.5 | 221 | 20-38 20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF606-P58 | Sn/Ag3.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF607-P58 | Sn/Ag3.5/Cu0.7 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF608-P58 | Sn/Ag3.9/Cu0.6 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF609-P58 | Sn/Ag3.8/Cu0.7 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF610-P58 | Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| PF614-P58 | Sn/Ag4.0/Cu0.5 | 217-219 | 20-38/20-45 | ROL1 | 11¡Ó0.5 | 200¡Ó30 |
| Item | Alloy Composition | Melting Point (¢XC) | Particle Size (£gm) | Flux Type | Flux Content (%) | Viscosity (Pa.s) |
|---|---|---|---|---|---|---|
| PF606-PW | Sn/Ag3.0/Cu0.5 | 217-219 | 20-38/ 20-45 | ORH0 | 11¡Ó0.5 | 200¡Ó30 |
| PF610-PW | Sn/Ag3.0/Cu0.5/Ni0.06/Ge0.01 | 217-219 | 20-38/20-45 | ORH0 | 11¡Ó0.5 | 200¡Ó30 |